Single-Chamber Eight-Source Resistive Coating Equipment

1. Vacuum chamber body: 1 set

1. Appearance: One set of high-quality 304 stainless steel D-shaped front and rear doors (the rear door is a hinged square door for convenient cleaning of the vacuum chamber, internal commissioning and maintenance, and loading/unloading of items; the front door is a horizontal pull-type square door); one set of DN100 viewing windows for both the front and rear doors; one vacuum chamber (internal dimensions: D400 × 480 mm).
2. Bottom: Metal Evaporation Source Interface Eight sets, one set of JTFB-600 air-cooled composite molecular pump interfaces, two sets of CF25 lighting interfaces, and from the United States. MCVAC Water-cooled film thickness probe interface 2 sets;
3. Top: Sample Stage Interface One set, one set of electric damper interfaces, and one set of KF16 pneumatic angle valve interfaces;
4. Left side: One set of CF35 pneumatic pre-pump angle valve interface.

2. Evaporation Source System: 1 set

1. Metal Evaporation Source 8 sets: Water-cooled copper electrode Eight sets, compatible with evaporation boats (tungsten, molybdenum, and tantalum boats) and helical filaments; tool-free disassembly; equipped with pneumatic shutters; four 1 kW silicon-controlled rectifier power supplies with digital displays; current adjustment accuracy of 1 A (fine-tuning); power output sufficient for the evaporation deposition of common metals and metal oxides.
2. The metal source is compatible with organic vapor deposition;
3. Partition: The evaporation sources are independent and separated by partitions to prevent cross-contamination.

3. Sample stage system: 1 set

1. Substrate rotation: Rotational speed Continuously adjustable from 0 to 30 rpm;
2. Substrate lifting: electrically driven, with adjustable spacing between the substrate and the evaporation source. Continuously adjustable via the touchscreen from 240 to 340 mm;
3. Substrate holder: A 130×130 mm substrate holder, capable of accommodating up to 25 15×15 mm substrates, for example;
4. Substrate baffle: electric baffle.

4. Vacuum pump unit: 1 set

1. One JTFB-600 air-cooled composite molecular pump;
2. 8 L/s direct-drive rotary vane pump 1 unit;
3. One CF150 high-vacuum pneumatic slide valve;
4. One CF35 high-vacuum pneumatic butterfly valve;
5. One KF16 high-vacuum pneumatic butterfly valve;
6. One KF40 high-vacuum pneumatic butterfly valve;
7. One KF40 vacuum solenoid inflation valve;
8. Two sets of KF40 pump-valve connection hoses and one set of KF40 tees;
9. One ZDF-5227 digital vacuum gauge (measurement range: 1×10⁵ to 1×10⁻⁵ Pa).

5. Film Thickness Measurement System: 1 set

1. Film thickness gauge: United States infocon ， One set of SQC310 two-channel quartz crystal oscillator film-thickness monitor;
2. Film thickness probe : United States MCVAC Water-cooled film thickness probe Two sets.

6. Equipment rack: 1 set

1. One set of welded frame made of 40 carbon steel square tubing, with a powder-coated surface;
2. Four 3-inch swivel casters for easy movement and adjustment;
3. Four M16 anchor bolts for locking and positioning.

7. Other electrical control systems: 1 set (electrical control is integrated within the equipment rack).

1. Baking lighting power supply: 1 unit;
2. Main control power supply ( Match 10-inch touchscreen, PLC controller, sample stage controller, evaporation power supply, pump and valve switch , phase sequence detection, and cable switch connectors, etc. ): 1 unit;

8. Other technical parameters:

1. Phase-loss protection, misoperation protection, interlock and mutual locking, as well as one-button vacuum start/stop functions;
2. Power supply: ~ 220V two-phase power supply system (peak power 3 kW);
3. Water Supply: Small Chiller, Cooling Water Temperature 5°C to 35°C; operating ambient temperature: 10°C to 40°C.
4. Air supply: small oil-free silent air pump, providing 0.2–0.3 MPa air pressure to actuate the pneumatic valve;
5. Ultimate vacuum: better than The vacuum level ranges from 6×10⁻⁵ Pa to 6×10⁻⁴ Pa within a time of less than 35 minutes when dry nitrogen is purged; after 12 hours of shutdown, the residual pressure is ≤10 Pa.