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Magnetron sputtering

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Magnetron Sputtering Coating Equipment


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Product Description

Advantages of magnetron sputtering:
1. Thin films can be fabricated from virtually all metals, alloys, and ceramic materials.
2. The coating rate is easy to control, the deposition rate is high, and the power efficiency is high.
3. It is a low-energy sputtering process, resulting in minimal substrate temperature rise.
 
Scope of application:
● Electronics industry (IC semiconductor components, display components, magnetic recording, optoelectronics, piezoelectric thin films)
● Solar energy utilization (solar cells, absorptive films, reflective films)
● Optical Applications (Gratings)
● Mechanochemical applications (lubrication, wear resistance, corrosion resistance)
● Plastics industry (decorative, hardening)
 
Fully enclosed magnetron sputtering (PVD)
● Ultimate vacuum: ≤5.0×10 -5 Pa.
● Restore vacuum: The system is evacuated from atmospheric pressure to 6.0×10 -4 Pa ≤ 40 min.
● Film thickness non-uniformity ≤ ±5%; inter-sheet non-uniformity ≤ ±5%; batch-to-batch non-uniformity ≤ ±5%.
● The sputtering target is positioned at the top, with the substrate holder at the bottom.
● Orbital and rotational substrate stage with continuously adjustable rotation speed.
● Sample heating temperature: 0–250°C, continuously adjustable; substrate temperature uniformity: ≤±5°C; temperature control accuracy: ±1°C.
● Pumping system: mechanical pump and molecular pump unit.
● Control System: The system is controlled via a touch screen and an imported PLC.
 
Specific configurations and structures can be customized.
 
 

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